Following is the transcript of the video. Narrator: This is 2D hand-drawn animation. [horns toot] And this is 3D computer-generated animation. But many films actually fall somewhere in between -- or ...

DEAR BONNIE: I have been hearing about moving into a 5D world of consciousness, and I am not sure exactly what that entails, but I am noticing a difference in my attitude about what is acceptable and ...

WeiHsun is a guest author and Deputy Manager, Core Methodology Department, at Global Unichip Corp. In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die ...

Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

Two software tools, Innovator3D IC and Calibre 3DStress, address chiplet integration and thermal management at the transistor level. Siemens Digital Industries Software announced the duo at DAC 2025.

Experimental data has been obtained on nanostructured glass that could help to preserve huge amounts of data for over one million years, which may help record historical data for future generations.

With Xilinx releasing last year the first commercially available 28nm, 2.5D Stacked Silicon Interconnect (SSI) device (the Virtex-7 2000T FPGA) followed by TSMC announcing full manufacturing and ...